Part Number Hot Search : 
HRDB320 112MS KYW35A6 TMP87 2SD14 UCN5895A 74ALVC1 1N4004G
Product Description
Full Text Search
 

To Download UCLAMP3324P Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 Low Voltage TVS for ESD Protection
PROTECTION PRODUCTS - MicroClampTM Description
The Clamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect up to four lines operating at 3.3 volts.
TM
UCLAMP3324P
Features
Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Small package for use in portable electronics Protects four I/O Working voltage: 3.3V Flow thru design for easy layout Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology
The ClampTM3324P is a solid-state device designed specifically for transient suppression. It is constructed using Semtech's proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over traditional pn junction processes. They offer desirable characteristics for board level protection including fast response time, low clamping voltage and no device degradation. The Clamp3324P may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (15kV air, 8kV contact discharge). The "flow-thru" design of the device results in enhanced ESD performance due to reduced board trace inductance. The result is lower clamping voltage and a higher level of protection when compared to conventional TVS devices. The Clamp3324P is in an 8-pin, RoHs compliant, SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and notebook computers.
Mechanical Characteristics
SLP2116P8 package RoHs Compliant Nominal Dimensions: 2.1 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead Finish: NiPd Marking : Orientation Mark and Marking Code Packaging : Tape and Reel per EIA 481
Applications
Cellular Handsets & Accessories Personal Digital Assistants (PDA's) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players
Circuit Diagram
1 8 2 7 3 6 4 5
Package
2.10
12
1.60 0.50 BSC
0.58
GND
Device Schematic
Revision 01/05/2005
8 Pin SLP package (Bottom Side View) 2.1 x 1.6 x 0.58mm (Nominal)
1 www.semtech.com
UCLAMP3324P
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) Maximum Peak Pulse Current (tp = 8/20s) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k Ip p V PP TJ TSTG Value 40 5 +/- 20 +/- 15 -55 to +125 -55 to +150 Units Watts Amps kV C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Punch-Through Voltage Snap -Back Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Reverse Clamp ing Voltage Symbol VRWM V PT VSB IR VC VC VCR IPT = 2A ISB = 50mA VRWM = 3.3V IPP = 1A, tp = 8/20s Any I/O to Gnd IPP = 5A, tp = 8/20s Any I/O to Gnd IPP = 1A, tp = 8/20s Any I/O to Gnd I/O p in to Gnd VR = 0V, f = 1MHz I/O p in to Gnd VR = 3.3V, f = 1MHz 25 3.5 2.8 0.05 0.5 5.5 8.0 2.4 30 Conditions Minimum Typical Maximum 3.3 Units V V V A V V V pF
Junction Cap acitance
Cj
14
pF
2005 Semtech Corp.
2
www.semtech.com
UCLAMP3324P
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1
110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 0
Power Derating Curve
Peak Pulse Power - P PP (kW)
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Clamping Voltage vs. Peak Pulse Current
16
Forward Voltage vs. Forward Current
8
14 12 Clamping Voltage (V) 10 8 6 4 2 0 0 1 2 3 Peak Pulse Current (A) 4 5 6
6 Forward Voltage - VF (V)
4
Waveform Parameters: tr = 8s td = 20s
2 Waveform Parameters: tr = 8s td = 20s 0 0 1 2 3 Forward Current - IF (A) 4 5 6
Junction Capacitance vs. Reverse Voltage
1.2 1.1 1 Normalized Capcitance - Cj (pF) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1 1.5 2 2.5 3 3.5 Reverse Voltage - VR (V) Line-to-Line Line-to-Gnd f = 1 MHz
ESD Clamping (8kV Contact per IEC 61000-4-2)
2005 Semtech Corp.
3
www.semtech.com
UCLAMP3324P
PROTECTION PRODUCTS Applications Information
Device Connection Options The Clamp3324P is designed to protect four lines. It will present a high impedance to the protected line up to 3.3 volts. It will "turn on" when the line voltage exceeds 3.5 volts. The device is unidirectional and may be used on lines where the signal polarity is above ground. Flow Thru Layout The Clamp3324P is designed for ease of PCB layout by allowing the traces to enter one side of the device and exit the other side. Figure 2 shows the recommended way to design the PCB board traces in order to use the flow through layout. The solid line represents the PCB trace. Note that the PCB traces enter at the input pin and exit from the opposite pin. (pin 1 to pin 8, pin 2 to pin 9, pin 3 to pin 6, pin 4 to pin 5). For example, line 1 enters at pin 1 and exits at Pin 8. The bottom tab is connected to ground. This connection should be made directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. EPD TVS Characteristics These devices are constructed using Semtech's proprietary EPD technology. The structure of the EPD TVS is vastly different from the traditional pn-junction devices. At voltages below 5V, high leakage current and junction capacitance render conventional avalanche technology impractical for most applications. However, by utilizing the EPD technology, these devices can effectively operate at 3.3V while maintaining excellent electrical characteristics. The EPD TVS employs a complex nppn structure in contrast to the pn structure normally found in traditional silicon-avalanche TVS diodes. The EPD mechanism is achieved by engineering the center region of the device such that the reverse biased junction does not avalanche, but will "punch-through" to a conducting state. This structure results in a device with superior DC electrical parameters at low voltages while maintaining the capability to absorb high transient currents. Figure 1 - Circuit Diagram
1
8
2
7
3
6
4
5
GND
Figure 2 - Layout Example
In 1 In 2 In 3 In 4
Out 1 Out 2 Out 3 Out 4
Figure 3 - EPD TVS IV Characteristic Curve
IPP
ISB
IPT VF IR VRWM V VPT VC SB
IF
2005 Semtech Corp.
4
www.semtech.com
UCLAMP3324P
PROTECTION PRODUCTS Outline Drawing - SLP2116P8
A D B
DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX
A A1 A2 b D D1 E E1 e L N aaa bbb .020 .023 .026 - .001 .002 (.006) .007 .010 .012 .079 .083 .087 .061 .067 .071 .059 .063 .067 .010 .016 .020 .020 BSC .011 .013 .015 6 .003 .004 0.50 0.58 0.65 0.00 .003 0.05 (0.15) 0.20 0.25 0.30 2.00 2.10 2.20 1.55 1.70 1.80 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.28 0.33 0.38 6 0.08 0.10
PIN 1 INDICATOR (LASER MARK)
E
A aaa C A2 D1 12 LxN E1 N e D/2 E/2 A1 C
SEATING PLANE
bxN bbb CAB
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP2116P8
P X
DIMENSIONS DIM B C F G P X Y Z INCHES .071 .060 .018 .035 .020 .012 .025 .085 MILLIMETERS 1.80 1.52 0.45 0.89 0.50 0.30 0.63 2.15
Z
G
F
(C)
Y
B
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2005 Semtech Corp.
5
www.semtech.com
UCLAMP3324P
PROTECTION PRODUCTS Marking Ordering Information
Part Number Working Voltage 3.3V Device Qty per Marking Reel 3324P 3,000 Reel Size 7 Inch
PIN 1 INDICATOR
3324P
uClamp 3324P.TCT
MicroClamp, uClamp and Clamp are marks of Semtech Corporation
Tape and Reel Specification
3324P
Device Orientation in Tape
3324P
3324P 3324P
3324P
3324P
3324P
A0 1.96 +/-0.05 mm
B0 2.31 +/-0.05 mm
K0 0.74 +/-0.05 mm
Tape Width
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1
E 1.750.10 mm (.069.004)
F
K (MAX)
P 4.00.1 mm (.157.004)
P0 4.00.1 mm (.157.004)
P2
T(MAX)
W 8.0 mm + 0.3 mm - 0.1 mm (.312.012)
8 mm
4.2 mm (.165)
0.8 mm 0.05 (.031)
3.50.05 mm (.138.002)
2.4 mm (.094)
2.00.05mm (.079.002)
0.4 mm (.016)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2005 Semtech Corp.
6


▲Up To Search▲   

 
Price & Availability of UCLAMP3324P

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X